Wafer profiling for etching system
US11501986B2 · kind B2 · utility
4Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2017 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Jun 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate etching system includes a support to hold a wafer in a face-up orientation, a dispenser arm movable laterally across the wafer on the support, the dispenser arm supporting a delivery port to selectively dispense a liquid etchant onto a portion of a top face of the wafer, and a monitoring system comprising a probe movable laterally across the wafer on the support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.