Patent · US Active

Electronic device with step cut lead

US11502045B2 · kind B2 · utility

0Cited by
14References
41Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 23, 2019
Grant dateNov 15, 2022
Priority date
Expiry dateJan 23, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2224/97
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An electronic device includes a semiconductor die, an enclosure, leads extending outwardly from the enclosure and electrically connected to the semiconductor die, and wherein the leads have a reduced cross-sectional area along a longitudinal length of the lead. The electronic device is designed to reduce the occurrence of crack formation between the leads and a printed circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.