Electronic device with step cut lead
US11502045B2 · kind B2 · utility
0Cited by
14References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2019 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Jan 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a semiconductor die, an enclosure, leads extending outwardly from the enclosure and electrically connected to the semiconductor die, and wherein the leads have a reduced cross-sectional area along a longitudinal length of the lead. The electronic device is designed to reduce the occurrence of crack formation between the leads and a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.