Amirul Afiq Hud
7Patents
1h-index
27Co-inventors
40Inventor score
Filing activity: Nov 24, 2016 → Jan 23, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10373897B2 | Semiconductor devices with improved thermal and electrical performance | Electricity | 3 | Active |
| US10083899B2 | Semiconductor package with heat slug and rivet free die attach area | Electricity | 1 | Active |
| US10204845B2 | Semiconductor chip package having a repeating footprint pattern | Electricity | 1 | Active |
| US10699978B2 | SMD package with top side cooling | Electricity | 0 | Active |
| US9972576B2 | Semiconductor chip package comprising side wall marking | Electricity | 0 | Active |
| US11502045B2 | Electronic device with step cut lead | Electricity | 0 | Active |
| US10147703B2 | Semiconductor package for multiphase circuitry device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.