Patent · US Active

Microelectronics package with enhanced thermal dissipation

US11502060B2 · kind B2 · utility

0Cited by

11References

12Claims

0Family size

Assignee

Rockwell Collins, Inc. · US

Inventors

Reginald D. Bean · Center Point, US
Bret W. Simon · West Liberty, US
Russell C. Tawney · Cedar Rapids, US
Ross K. Wilcoxon · Cedar Rapids, US

Key dates

Filing date	Nov 20, 2020
Grant date	Nov 15, 2022
Priority date	—
Expiry date	Nov 20, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19106
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package system is disclosed. The system includes a first interposer and a first integrated circuit die electrically coupled and thermally coupled to a first side of the first interposer. The system further includes a second integrated circuit die electrically coupled and thermally coupled to a second side of the first interposer. The system further includes a ring carrier electrically coupled and thermally coupled to the first interposer. The ring carrier is configured to transmit an input to the first interposer. In some embodiments, the system further includes at least one thermal spreader thermally coupled to the ring carrier and at least one of the first integrated circuit, the second integrated circuit, or the first interposer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.