Patent · US Active

Electronic device comprising optical electronic components and fabricating process

US11502227B2 · kind B2 · utility

0Cited by

2References

18Claims

0Family size

Assignee

STMicroelectronics (Grenoble 2) SAS · FR

Inventors

Romain Coffy · Voiron, FR
Remi Brechignac · Grenoble, FR
Jean-Michel Riviere · Meylan, FR

Key dates

Filing date	Aug 28, 2020
Grant date	Nov 15, 2022
Priority date	—
Expiry date	Dec 26, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0362
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic device includes a first electronic component and a second electronic. Each electronic component includes a carrier substrate having a back side and a front side, an electronic chip including an integrated optical element, an overmolded transparent block encapsulating the electronic chip above the carrier substrate, and electrical connections between the electronic chip and electrical contacts of the carrier substrate. An overmolded grid encapsulates and holds the first and second electronic components. The grid is configured so that sides of the first and second electronic components are at least partially exposed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.