Resin composition, prepreg, and printed circuit board
US11503708B2 · kind B2 · utility
0Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2021 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Mar 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0212
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resin composition, a prepreg, and a printed circuit board are provided. The resin composition is used to form a dielectric substrate layer. The resin composition includes a polymeric based material and fillers. Based on a total volume of the resin composition being 100 vol %, the resin composition includes 10 vol % to 60 vol % of the polymeric based material and 1 vol % to 80 vol % of the fillers. The fillers include hollow fillers, and the hollow fillers include a first hollow filler. A material of the first hollow filler is silicon dioxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.