Passive device packaging structure embedded in glass medium and method for manufacturing the same
US11503712B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Aug 16, 2021 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Aug 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/692
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A passive device packaging structure embedded in a glass medium according to an embodiment of the present disclosures includes a glass substrate and at least one capacitor embedded in the glass substrate. The capacitor includes an upper electrode, a dielectric layer, and a lower electrode. The glass substrate is provided on its upper surface with a cavity, the dielectric layer covers a surface of the cavity and has an area larger than that of the cavity. The upper electrode is provided on the dielectric layer. The dielectric layer and the lower electrode are connected by a metal via pillar passing through the glass substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.