Patent · US Active

Method for producing a micromechanical device having a damper structure

US11505455B2 · kind B2 · utility

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10Claims

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Assignee

Robert Bosch GmbH · DE

Inventors

Holger Hoefer · Tegernsee, DE
Klaus Offterdinger · Stuttgart, DE
Maximilian Amberger · Karlsruhe, DE
Michael Stumber · Ditzingen, DE

Key dates

Filing date	Nov 29, 2019
Grant date	Nov 22, 2022
Priority date	—
Expiry date	Dec 29, 2039

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0118
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.