Holger Hoefer
10Patents
3h-index
23Co-inventors
56Inventor score
Filing activity: Nov 21, 2001 → Nov 29, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8671752B2 | Sensor system | Electricity | 6 | Active |
| US6620735B2 | Method for processing substrates | Electricity | 6 | Expired |
| US9222955B2 | Damping device for a micromechanical sensor device | Emerging Cross-Sectional Technologies | 4 | Active |
| US6974515B2 | Ceramic substrate and method of manufacturing same | Electricity | 2 | Expired |
| US8304845B2 | Method for sealing an opening | Performing Operations; Transporting | 1 | Active |
| US7564033B2 | Microstructured sensor | Emerging Cross-Sectional Technologies | 1 | Expired |
| US10684185B2 | Sensor and/or sound detection device and manufacturing method for a sensor and/or sound detection device | Physics | 0 | Active |
| US11505455B2 | Method for producing a micromechanical device having a damper structure | Performing Operations; Transporting | 0 | Active |
| US8810252B2 | Solder joint inspection | Electricity | 0 | Active |
| US10584029B2 | Method for producing thin MEMS chips on SOI substrate and micromechanical component | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.