Patent · US Active

Adjustable fluid inlet assembly for a substrate processing apparatus and method

US11505864B2 · kind B2 · utility

0Cited by

7References

15Claims

0Family size

Assignee

Picosun Oy · FI

Inventors

Timo Malinen · Espoo, FI
Vaino Kilpi · Sundsberg, FI
Marko PUDAS · Sundsberg, FI

Key dates

Filing date	Jun 21, 2017
Grant date	Nov 22, 2022
Priority date	—
Expiry date	Jan 29, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67126
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A substrate processing apparatus, includes a sealed pressure vessel, such as an Atomic Layer Deposition, ALD, apparatus, a fluid inlet assembly attached to a wall of the sealed pressure vessel, the fluid inlet assembly having a fluid inlet pipe passing through the wall, and a resilient element in the fluid inlet assembly around the fluid inlet pipe coupling the inlet pipe to the wall, where one of an interior surface and an exterior surface of the resilient element sees pressure prevailing within the pressure vessel and the other sees ambient pressure, and where the fluid inlet pipe prevents fluid carried inside from being in contact with the resilient element, and a relating method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.