Hybrid EO polymer modulator with ALD sealant layer
US11506918B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2021 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Jun 4, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/065
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An EO polymer modulator with conformal atomic layer deposition sealant layers including an active region of a device material stack with an elongated tapered active section positioned on a passive waveguide core. The device material stack supported on a substrate with the passive waveguide core defining light input and light output side surfaces. A conformal atomic layer deposition sealant layer overlying the device material stack including the light input and light output side surfaces, the conformal atomic layer deposition sealant layer defining windows for the light input and light output side surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.