Surface treatment compositions and methods
US11508569B2 · kind B2 · utility
1Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2020 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Aug 3, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B7/0014
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
This disclosure relates to methods and compositions for treating a semiconductor substrate having a pattern disposed on a surface of the substrate. The methods can include a) supplying a sublimating material to a substrate having a pattern disposed on a surface thereof; b) maintaining the sublimating material on the surface for a time sufficient to modify the surface; c) solidifying the sublimating material on the surface; and d) removing by sublimation the sublimating material disposed on the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.