Electrical connection structure and method of forming the same
US11508619B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2019 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Jan 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13024
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments may provide a method of forming an electrical connection structure. The method may include forming a cavity on a front surface of a substrate, the substrate including an electrically conductive pad, by etching through the electrically conductive pad. The method may also include forming one or more dielectric liner layers covering an inner surface of the cavity. The method may further include forming a via hole extending from the cavity by etching through the one or more dielectric liner layers, forming one or more further dielectric liner layers covering an inner surface of the via hole. The method may additionally include depositing a suitable electrically conductive material into the cavity and the via hole to form a conductive via having a first portion in the cavity and a second portion in the via hole, a diameter of the first portion different from a diameter of the second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.