Sunil Wickramanayaka
18Patents
7h-index
20Co-inventors
66Inventor score
Filing activity: Jun 13, 1996 → Jan 24, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7159537B2 | Device for fixing a gas showerhead or target plate to an electrode in plasma processing systems | Electricity | 38 | Expired |
| US6462482B1 | Plasma processing system for sputter deposition applications | Electricity | 28 | Expired |
| US6216632A | Plasma processing system | Electricity | 23 | Expired |
| US6333601A | Planar gas introducing unit of a CCP reactor | Electricity | 12 | Expired |
| US7623334B2 | Electrostatic chuck device | Electricity | 11 | Expired |
| US6225746A | Plasma processing system | Electricity | 9 | Expired |
| US7848077B2 | Electrostatic chuck device | Electricity | 7 | Active |
| US5962083A | Methods of depositing films on polymer substrates | Electricity | 6 | Expired |
| US7791857B2 | Electrostatic chuck device | Electricity | 4 | Active |
| US10249593B2 | Method for bonding a chip to a wafer | Electricity | 4 | Active |
| US7164571B2 | Wafer stage with a magnet | Electricity | 3 | Expired |
| US7724493B2 | Electrostatic chuck device | Electricity | 2 | Active |
| US7625472B2 | Plasma-assisted sputter deposition system | Physics | 2 | Active |
| US7816283B2 | Method of depositing a higher permittivity dielectric film | Electricity | 1 | Expired |
| US8986522B2 | Angled sputtering physical vapor deposition apparatus with wafer holder and wafer holder for an angled sputtering physical vapor deposition apparatus | Electricity | 1 | Active |
| US10134607B2 | Method for low temperature bonding of wafers | Electricity | 0 | Active |
| US9613928B2 | Method and apparatus for chip-to-wafer integration | Electricity | 0 | Active |
| US11508619B2 | Electrical connection structure and method of forming the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.