Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips
US11508688B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2017 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Oct 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06568
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention has: a heater; and a bonding tool having a lower surface on which a memory chip is adsorbed; and an upper surface attached to the heater, and is provided with a bonding tool which presses the peripheral edge of the memory chip to a solder ball in a first peripheral area of the lower surface and which presses the center of the memory chip (60) to a DAF having a heat resistance temperature lower than that of the solder ball in a first center area. The amount of heat transmitted from the first center area to the center of the memory chip is smaller than that transmitted from the first peripheral area (A) to the peripheral edge of the memory chip. Thus, the bonding apparatus in which the center of a bonding member can be heated to a temperature lower than that at the peripheral edge can be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.