Method of enhancing copper electroplating
US11512406B2 · kind B2 · utility
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4References
6Claims
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Key dates
| Filing date | Sep 21, 2020 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Sep 21, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.