Patent · US Active

Selective deposition of a passivation film

US11515154B2 · kind B2 · utility

0Cited by

5References

20Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Andrea Leoncini · Singapore, SG
Yong Wang · Suzhou, CN
Doreen Wei Ying Yong · Singapore, SG

Key dates

Filing date	Oct 27, 2020
Grant date	Nov 29, 2022
Priority date	—
Expiry date	Dec 30, 2040

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2201/0198
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Selective deposition methods are described. An exemplary method comprises exposing the substrate comprising a first surface and a second surface to an anchor reactant and selectively depositing the anchor reactant on the first surface as a seed layer, wherein the anchor reactant comprises an ethynyl derivative with a headgroup that selectively targets the first surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.