Reconstituted wafer including mold material with recessed conductive feature
US11515225B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2020 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Sep 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19031
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method. The system may include an integrated circuit (IC) die having two faces and sides. The system may further include mold material surrounding at least the sides of the IC die. The system may further include a redistribution layer and signal pads. The redistribution layer may be positioned between (a) the signal pads and (b) the mold material and the IC die. The redistribution layer may have conductive paths at least connecting the IC die and at least some of the signal pads. A surface of the mold material may abut the redistribution layer. The surface of the mold material may include at least one recessed area having at least one conductive feature connected to at least one of the conductive paths or the IC die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.