Semiconductor packaging structure having antenna module
US11515269B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2018 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Jan 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor packaging structure includes: a substrate, a redistribution layer having one conductive plugs, metal bumps disposed on the redistribution layer, and electrically connected with the redistribution layer including the conductive plug; a semiconductor chip over the redistribution layer and aligned to and electrically connected with the conductive plug; an underfill layer filling a gap between the redistribution layer and the semiconductor chip and the conductive plugs; a polymer layer on the redistribution layer, over the plurality of metal bumps, the underfill layer and the semiconductor chip, exposing only top parts of the plurality of metal bumps and top part of the semiconductor chip; and an antenna module disposed on the second surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.