Multi wire bonding with current sensing method
US11519943B2 · kind B2 · utility
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17Claims
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Assignee
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Key dates
| Filing date | Nov 5, 2020 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Nov 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Implementations of a semiconductor package system may include a first bond wire bonded to a portion of a leadframe and to a pad of a semiconductor die, the first bond wire coupled to one of a power source or a ground; and a second bond wire bonded to the portion of the leadframe and to a control integrated circuit. The portion of the leadframe may form a current sense area and the control integrated circuit may be configured to use the second bond wire and the current sense area to measure a current flowing through the first bond wire during operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.