Imprint method, imprint apparatus, imprint system, and method of manufacturing article
US11520226B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2018 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Jul 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0271
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides an imprint method of performing a forming process which includes supplying an imprint material on a substrate and then forming a pattern of the imprint material on the substrate by using a mold, the method comprising: dispensing, on the substrate, an adhesion material to bring the substrate and the imprint material into tight contact with each other; performing a first annealing process of heating and cooling the substrate on which the adhesion material has been dispensed; conveying the substrate to which the first annealing process has been performed; performing a second annealing process of heating and cooling the substrate which has been conveyed in the conveying; and performing the forming process on the substrate to which the second annealing process has been performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.