Patent · US Active

Lithography supports with defined burltop topography

US11520241B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

ASML Holding N.V. · NL

Inventors

Matthew Lipson · Sunnyvale, US
David Heald · Brookfield, US
Iliya Sigal · Stamford, US

Key dates

Filing date	Nov 29, 2018
Grant date	Dec 6, 2022
Priority date	—
Expiry date	Dec 24, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68757
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Methods and systems are described for reducing adhesion and controlling friction between a wafer and a wafer table during semiconductor photolithography wherein the tops of burls on the wafer table have a layer with a nanoscale topography.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.