Microelectronic assemblies having a cooling channel

US11521914B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Zhimin Wan · Chandler, US
• Cheng Xu · Chandler, US
• Yikang Deng · New York, US
• Junnan Zhao · Gilbert, US
• Ying Wang · Taichung, TW
• Chong Zhang · Chandler, US
• Kyu Oh Lee · Chandler, US
• Chandra Mohan Jha · Tempe, US
• Chia-Pin Chiu · Tempe, US

Key dates

• Filing date: Dec 27, 2018
• Grant date: Dec 6, 2022
• Expiry date: Apr 7, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/4882
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Microelectronic assemblies that include a cooling channel, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a surface, a die having a surface, and a fluidic channel between the surface of the die and the surface of the package substrate, wherein a top surface of the fluidic channel is defined by the surface of the die and a bottom surface of the fluidic channel is defined by the surface of the package substrate. In some embodiments, a microelectronic assembly may include a package substrate having a surface; a die having a surface; and an interposer having a fluidic channel between the surface of the die and the surface of the package substrate.