Epitaxial oxide materials, structures, and devices
US11522103B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 22, 2022 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Feb 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/27
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides techniques for epitaxial oxide materials, structures and devices. In some embodiments, a semiconductor structure includes an epitaxial oxide heterostructure, comprising: a substrate; a first epitaxial oxide layer comprising (Nix1Mgy1Zn1−x1−yl)2GeO4 wherein 0≤x1≤1 and 0≤y1≤1; and a second epitaxial oxide layer comprising (Nix2Mgy2Zn1−x2−y2)2GeO4 wherein 0≤x2≤1 and 0≤y2≤1. In some cases, either: x1≠x2 and y1=y2; x1=x2 and y1≠y2; or x1≠x2 and y1≠y2. In some embodiments, a semiconductor structure includes an epitaxial oxide heterostructure, comprising: a substrate; a first epitaxial oxide layer comprising (Mgx1Zn1−x1)(Aly1Ga1−y1)2O4 wherein 0≤x1≤1 and 0≤y1≤1; and a second epitaxial oxide layer comprising (Nix2Mgy2Zn1−x2−y2)2GeO4 wherein 0≤x2≤1 and 0≤y2≤1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.