Minimal contact gripping of thin optical devices
US11524392B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2021 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Apr 22, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein provide for devices and methods for retaining optical devices. The devices and methods described herein provide for retention of the substrate without contacting sensitive portions of the substrate. The devices and methods utilize retention pads or vacuum pins to contact the exclusion zones i.e., inactive areas of the substrate to retain the substrate and prevent the substrate from moving laterally. Additionally, a holding force retains the substrate in the vertical direction, without contacting the substrate. The methods provide for adjusting the devices to account for multiple geometries of the substrate. The methods further provide for adjusting the devices, such as adjusting a gap between the optical device and a suction pad, to alter the holding force of the devices on the optical devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.