Metal compounds and methods of fabricating semiconductor devices using the same
US11524973B2 · kind B2 · utility
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5References
20Claims
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Key dates
| Filing date | Apr 24, 2020 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Jan 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/692
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
Described herein are metal compounds and methods of fabricating semiconductor devices using the same. The metal compounds include a material of Chemical Formula 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.