Patent · US Active

Manufacturing fluid sensing packages

US11525820B2 · kind B2 · utility

3Cited by

2References

34Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Sebastian Meier · Munich, DE
Heinrich Wachinger · Helfenbrunn, DE
Bernhard Lange · Gerolzhofen, DE

Key dates

Filing date	Sep 16, 2019
Grant date	Dec 13, 2022
Priority date	—
Expiry date	Sep 16, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/14
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

In examples, a method of manufacturing a fluid sensing package comprises coupling a semiconductor die to a first set of conductive terminals; positioning the semiconductor die within a socket, a fluid probe extending through a probe orifice in a lid of the socket; positioning a ring of the fluid probe on a fluid sensing portion of the semiconductor die by closing the lid of the socket; and using the fluid probe to apply fluid to an area of the fluid sensing portion circumscribed by the ring.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.