Bernhard Lange
27Patents
7h-index
19Co-inventors
66Inventor score
Filing activity: Jan 16, 1986 → Jul 17, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7578422B2 | Bond capillary design for ribbon wire bonding | Electricity | 111 | Active |
| US7216794B2 | Bond capillary design for ribbon wire bonding | Electricity | 49 | Expired |
| US7608484B2 | Non-pull back pad package with an additional solder standoff | Emerging Cross-Sectional Technologies | 38 | Active |
| US7335536B2 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | Electricity | 27 | Expired |
| US7741704B2 | Leadframe and mold compound interlock in packaged semiconductor device | Electricity | 11 | Active |
| US7863098B2 | Flip chip package with advanced electrical and thermal properties for high current designs | Electricity | 8 | Active |
| US7635613B2 | Semiconductor device having firmly secured heat spreader | Electricity | 7 | Expired |
| US4646704A | Pressure wave supercharger with vibration damped rotor | Mechanical Engineering; Lighting; Heating | 6 | Expired |
| US7256482B2 | Integrated circuit chip packaging assembly | Electricity | 5 | Expired |
| USRE46466E1 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | General | 4 | Active |
| US8884343B2 | System in package and method for manufacturing the same | Electricity | 4 | Active |
| US11525820B2 | Manufacturing fluid sensing packages | Electricity | 3 | Active |
| US7476976B2 | Flip chip package with advanced electrical and thermal properties for high current designs | Electricity | 3 | Active |
| US7074653B2 | Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages | Electricity | 3 | Expired |
| US7221055B2 | System and method for die attach using a backside heat spreader | Electricity | 3 | Expired |
| US8039956B2 | High current semiconductor device system having low resistance and inductance | Electricity | 3 | Active |
| US8053876B2 | Multi lead frame power package | Electricity | 2 | Active |
| US8232144B2 | Non-pull back pad package with an additional solder standoff | Emerging Cross-Sectional Technologies | 2 | Active |
| US7808088B2 | Semiconductor device with improved high current performance | Electricity | 1 | Active |
| US11837513B2 | O-ring seals for fluid sensing | Electricity | 1 | Active |
| US9458401B2 | Use of substituted ureas or urethanes for improvement of the use properties of mineral and synthetic nonaqueous industrial fluids | Chemistry; Metallurgy | 1 | Active |
| US7361977B2 | Semiconductor assembly and packaging for high current and low inductance | Electricity | 1 | Expired |
| USRE48420E1 | Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices | General | 0 | Active |
| US8154117B2 | High power integrated circuit device having bump pads | Electricity | 0 | Active |
| US7531895B2 | Integrated circuit package and method of manufacture thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.