Integrated assemblies and methods of forming integrated assemblies
US11527623B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 28, 2020 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Aug 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B53/30
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Some embodiments include an integrated transistor having an active region comprising semiconductor material. The active region includes a first source/drain region, a second source/drain region and a channel region between the first and second source/drain regions. A conductive gating structure is operatively proximate the channel region and comprises molybdenum. The integrated transistor may be incorporated into integrated memory, such as, for example, DRAM, FeFET memory, etc. Some embodiments include methods of forming integrated assemblies and devices, such as, for example, integrated transistors, integrated memory, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.