Planar power module with spatially interleaved structure
US11532557B2 · kind B2 · utility
1Cited by
0References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2020 |
| Grant date | Dec 20, 2022 |
| Priority date | — |
| Expiry date | Dec 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/33181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a planar power module with a spatially interleaved structure, including a top power substrate, a bottom power substrate arranged opposite to the top power substrate, and a plurality of interleaved switch units configured between the top power substrate and the bottom power substrate; wherein adjacent interleaved switch units are electrically connected through a current commutator so that the interleaved switch units form spatial position interleaving. Problems of uneven parallel currents and uneven heat dissipation in the power module are solved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.