Dingkun Ma
2Patents
1h-index
8Co-inventors
27Inventor score
Filing activity: May 22, 2020 → Dec 28, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11532557B2 | Planar power module with spatially interleaved structure | Electricity | 1 | Active |
| US11158609B2 | Three-dimensional integrated package device for high-voltage silicon carbide power module | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.