Hybrid socket for higher thermal design point processor support
US11532906B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2018 |
| Grant date | Dec 20, 2022 |
| Priority date | — |
| Expiry date | Jul 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/714
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A power delivery system for a hardware processor includes a motherboard (MB), a voltage regulator (VR), an elastomer computer socket, and a plurality of power delivery paths within the socket. The socket connects the MB to the processor and comprises a first set of power pins that is connected to the processor by surface mount elements, and a second set of power pins that is not connected to the processor by surface mount elements. The plurality of electrical power delivery paths deliver VR power from the second set of C power pins to the first set of power pins for power delivery to the processor. The alignment frame aligns the processor, the plurality of power pins, and the MB. The plurality of power paths alone may meet the power demands of the processor. If not, a power plane from the MB provides additional power.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.