Fernando Gonzalez Lenero
4Patents
0h-index
19Co-inventors
31Inventor score
Filing activity: Mar 31, 2017 → Oct 31, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10408860B2 | Interconnection system with flexible pins | Electricity | 0 | Active |
| US11532906B2 | Hybrid socket for higher thermal design point processor support | Electricity | 0 | Active |
| US12131977B2 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Electricity | 0 | Active |
| US11842943B2 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.