Patent · US Active

Power electronics submodule for mounting on a cooling device

US11533822B2 · kind B2 · utility

0Cited by

0References

11Claims

0Family size

Assignee

SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

Ingo Bogen · Nuremberg, DE
Alexander Wehner · Nuremberg, DE

Key dates

Filing date	Feb 12, 2021
Grant date	Dec 20, 2022
Priority date	—
Expiry date	Jul 22, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/18
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power electronics submodule for mounting on a cooling device, has first and second surface sections next to one another, a substrate with a housing and includes a connection element, conductively connected by a contact to a track of the substrate and a connection section, arranged parallel to the substrate, the substrate arranged on the first surface section, the housing has a housing section, with a first main surface, arranged on the second surface section, and a second main surface, situated opposite the first main surface. In a non-mounted state a first main surface of the connection section is a first distance from the second main surface of the housing section in the housing region of a fastening device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.