Polishing pad with improved fluidity of slurry and process for preparing same
US11534888B2 · kind B2 · utility
1Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2019 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Jul 22, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a polishing pad that comprises a plurality of first grooves that have a shape of geometric figures that share a center; and a plurality of second grooves that radially extend from the center to the outer perimeter, wherein the depth of the second grooves is equal to, or deeper than, the depth of the first grooves. It is possible for the polishing pad to rapidly discharge any debris generated during the polishing process to reduce such defects as scratches on the surface of a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.