Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the same
US11538708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2020 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Feb 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus includes an electrostatic chuck and located within a vacuum enclosure. A plurality of conductive plates can be embedded in the electrostatic chuck, and a plurality of plate bias circuits can be configured to independently electrically bias a respective one of the plurality of conductive plates. Alternatively or additionally, a plurality of spot lamp zones including a respective set of spot lamps can be provided between a bottom portion of the vacuum enclosure and a backside surface of the electrostatic chuck. The plurality of conductive plates and/or the plurality of spot lamp zones can be employed to locally modify chucking force and to provide local temperature control.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.