Electronic chip with under-side power block
US11538753B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2016 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Oct 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic chip, system, and method includes a power block including a power source configured to provide power to components of the electronic chip and a relay circuit coupled to the power source and a ground plane. The electronic chip further includes chip package having a first major side and a second major side, the power block secured to the second major side, the chip package comprising electrical connections, disposed on the second major side, to be secured with respect to a circuit board, and interconnect circuitry, electrically coupling the power block to ground, comprising a plurality of conductive layers, a conductive through hole, electrically connecting a first pair of the plurality of conductive layers, having a first width, and a via, electrically connecting a second pair of the plurality of conductive layers, having a second width less than the first width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.