Semiconductor device package and method of manufacturing the same
US11538772B2 · kind B2 · utility
0Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2020 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Dec 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/06
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an antenna module. The antenna module includes a first layer, a second layer, a first antenna, and a second antenna. The first layer has a first dielectric constant. The second layer is adjacent to the first layer. The second layer has a second Dk lower than the first Dk. The first antenna is disposed on the first layer and is configured for operating at a first frequency. The second antenna is disposed on the second layer and is configured for operating at a second frequency higher than the first frequency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.