Recycled polishing pad
US11541504B2 · kind B2 · utility
0Cited by
10References
20Claims
0Family size
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Inventors
Key dates
| Filing date | Jun 28, 2019 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Aug 5, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A recycled polishing pad includes an upper layer pad and a supplementary pad. The upper layer pad includes a first surface and a second surface opposite to the first surface. The first surface has a plurality of first grooves and the second surface has a plurality of second grooves. The upper layer pad further includes a connecting body connecting the first grooves and the second grooves. The supplementary pad is in contact with the second surface of the upper layer pad. A depth of each of the first grooves is less than a depth of each of the second grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.