Plating method, plating apparatus, and method for estimating limiting current density
US11542618B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2020 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Jul 7, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating method for plating a substrate by increasing a current value from a predetermined current value to a first current value is provided. The plating method plates the substrate for a first predetermined period with the first current value when a first current density corresponding to the first current value is lower than a limiting current density. This plating method includes measuring a voltage value applied to the substrate, and when the current value is increased from the predetermined current value to the first current value, determining whether the first current density is equal to or more than the limiting current density or not based on an amount of change in the voltage value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.