Method for measuring the heights of wire interconnections
US11543362B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2020 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Apr 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/85035
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A height of a vertical wire interconnection bonded onto a substrate is measured by first capturing a top view of the vertical wire interconnection and identifying a position of a tip end of the vertical wire interconnection from the top view. A conductive probe is located over the tip end of the vertical wire interconnection, and is lowered towards the vertical wire interconnection until an electrical connection is made between the conductive probe and the tip end of the vertical wire interconnection. A contact height at which the electrical connection is made may thus be determined, wherein the contact height corresponds to the height of the vertical wire interconnection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.