ASMPT SINGAPORE PTE. LTD.
25Patents
25Active
25Granted
55Portfolio score
Filing activity: Aug 9, 2018 → Nov 9, 2023
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11695915B1 | Apparatus and method for imaging lens alignment using a virtual test image | Physics | 1 | Active |
| US11798911B1 | Force sensor in an ultrasonic wire bonding device | Electricity | 0 | Active |
| US11559823B2 | Volumetric measurement and regulation device incorporated in a time-pressure dispenser | Performing Operations; Transporting | 0 | Active |
| US11543362B2 | Method for measuring the heights of wire interconnections | Electricity | 0 | Active |
| US12020959B2 | Detape apparatus for an optical alignment machine | Electricity | 0 | Active |
| US11955347B2 | Encapsulation process for double-sided cooled packages | Electricity | 0 | Active |
| US11552031B2 | High precision bonding apparatus comprising heater | Electricity | 0 | Active |
| US11548273B2 | Apparatus and method for removing a film from a surface | Emerging Cross-Sectional Technologies | 0 | Active |
| US11776930B2 | Die bond head apparatus with die holder motion table | Electricity | 0 | Active |
| US11764098B2 | Detaching a die from an adhesive tape by air ejection | Emerging Cross-Sectional Technologies | 0 | Active |
| US12304002B2 | Laser-cutting using selective polarization | Performing Operations; Transporting | 0 | Active |
| US12392390B2 | Apparatus and method for vibration attenuation | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US11621181B2 | Dual-sided molding for encapsulating electronic devices | Electricity | 0 | Active |
| US11618172B2 | Ejector unit for detaching an electronic element from an adhesive carrier | Electricity | 0 | Active |
| US11676937B2 | Flexible sinter tool for bonding semiconductor devices | Electricity | 0 | Active |
| US12304001B2 | Optimised laser cutting | Performing Operations; Transporting | 0 | Active |
| US11467270B2 | Apparatus and method for calibrating or testing an imaging device | Physics | 0 | Active |
| US12072251B2 | Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device | Performing Operations; Transporting | 0 | Active |
| US11842978B1 | Wire bonding system including a wire biasing tool | Performing Operations; Transporting | 0 | Active |
| US11600516B2 | Die ejector height adjustment | Electricity | 0 | Active |
| US12081868B2 | Aligning optical components along a predetermined reference optical path | Electricity | 0 | Active |
| US12396084B2 | Dielectric barrier discharge plasma generator | Electricity | 0 | Active |
| US11592477B2 | Test handler having multiple testing sectors | Electricity | 0 | Active |
| US11618231B2 | Apparatus and method for detecting failure in a mechanical press | Electricity | 0 | Active |
| US11622485B1 | Flexural pick arm for a pick and place apparatus | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.