Mold for forming a radio frequency (RF) coil for a plasma processing apparatus
US11545302B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 24, 2020 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Dec 12, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y80/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Various embodiments of molds and methods are disclosed herein for fabricating a radio frequency (RF) coil. The disclosed mold includes a cylindrical inner core having a first helically shaped groove formed within an outer surface of the cylindrical inner core, and a two-piece compression sleeve having a second helically shaped groove formed within an inner surface of the two-piece compression sleeve. When portions of the two-piece compression sleeve are attached together, the two-piece compression sleeve surrounds the cylindrical inner core and provide a compressive force to a conductor arranged within the first and second helically shaped grooves to fabricate the RF coil. In some embodiments, a three-dimensional (3D) printing process may be used to fabricate each piece of the mold separately.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.