Patent · US Active

Method of fastening a semiconductor chip on a lead frame, and electronic component

US11545369B2 · kind B2 · utility

0Cited by

2References

13Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Mathias Wendt · Eschborn, DE
Andreas Weimar · Regensburg, DE

Key dates

Filing date	Jun 29, 2021
Grant date	Jan 3, 2023
Priority date	—
Expiry date	Aug 7, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0364
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component includes a lead frame; a semiconductor chip arranged above the lead frame; and a connection layer sequence arranged between the lead frame and the semiconductor chip, wherein the connection layer sequence includes a first intermetallic layer including gold and indium or gold, indium and tin, a second intermetallic layer including indium and a titanium compound, indium and nickel, indium and platinum or indium and titanium, and a third intermetallic layer including indium and gold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.