Packaging for fingerprint sensors and methods of manufacture
US11545405B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2020 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Apr 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.