Inventor · Queen Creek, AZ, US

Brett Dunlap

22Patents
7h-index
15Co-inventors
62Inventor score

Filing activity: Sep 29, 2009 → Oct 24, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8432022B1 Shielded embedded electronic component substrate fabrication method and structure Electricity 36 Active
US8937381B1 Thin stackable package and method Electricity 31 Active
US8653674B1 Electronic component package fabrication method and structure Electricity 20 Active
US8535961B1 Light emitting diode (LED) package and method Electricity 19 Active
US9651513B2 Fingerprint sensor and button combinations and methods of making same Electricity 15 Active
US8791501B1 Integrated passive device structure and method Electricity 12 Active
US9013011B1 Stacked and staggered die MEMS package and method Electricity 9 Active
US8337657B1 Mechanical tape separation package and method Emerging Cross-Sectional Technologies 4 Active
US10055631B1 Semiconductor package for sensor applications Electricity 3 Active
US8753730B1 Mechanical tape separation package Emerging Cross-Sectional Technologies 2 Active
US9691734B1 Method of forming a plurality of electronic component packages Electricity 1 Active
US11119615B2 Fingerprint sensor and button combinations and methods of making same Electricity 0 Active
US11545405B2 Packaging for fingerprint sensors and methods of manufacture Electricity 0 Active
US10325132B2 Fingerprint sensor and button combinations and methods of making same Electricity 0 Active
US10546833B2 Method of forming a plurality of electronic component packages Electricity 0 Active
US10636717B2 Packaging for fingerprint sensors and methods of manufacture Electricity 0 Active
US10338754B2 Edge-effect mitigation for capacitive sensors Physics 0 Active
US8941250B1 Electronic component package fabrication method and structure Electricity 0 Active
US11829565B2 Fingerprint sensor and button combinations and methods of making same Electricity 0 Active
US12429988B2 Fingerprint sensor and button combinations and methods of making same Electricity 0 Active
USRE47890E1 Packaging for fingerprint sensors and methods of manufacture General 0 Active
US9754852B2 Packaging for fingerprint sensors and methods of manufacture Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.