Package structure and manufacturing method thereof
US11545412B2 · kind B2 · utility
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14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2020 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Feb 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.