Package comprising an integrated device coupled to a substrate through a cavity
US11545439B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2020 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Jan 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package that includes a substrate and an integrated device. The substrate includes a core portion, a first substrate portion and a second substrate portion. The core portion includes a core layer and core interconnects. The first substrate portion is coupled to the core portion. The first substrate portion includes at least one first dielectric layer coupled to the core layer, and a first plurality of interconnects located in the at least one first dielectric layer. The second substrate portion is coupled to the core portion. The second substrate includes at least one second dielectric layer coupled to the core layer, and a second plurality of interconnects located in the at least one second dielectric layer. The core portion and the second substrate portion include a cavity. The integrated device is coupled to the first substrate portion through the cavity of the second substrate portion and the core portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.