Apparatus and method for removing a film from a surface
US11548273B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2020 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Jan 22, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1994
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
After molding a substrate located between first and second molds of a molding system, a used release film that is in contact with the substrate during molding is removed from the molding system with a gripper assembly, which is reciprocally movable between a retracted position outside the molding system and an extended position in a space between the first and second molds when the first and second molds are opened. A carriage mechanism on which the gripper assembly is mounted moves the gripper assembly towards the first or second mold until the gripper assembly contacts the used release film, before an actuator actuates the gripper assembly to clamp onto a part of the used release film. The carriage mechanism also conveys the gripper assembly away from the first mold or second mold to remove the used release film from the molding system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.