Semiconductor manufacturing apparatus
US11551948B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2018 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Sep 12, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturing apparatus, including a chip supply module used for providing a plurality of chips; a load plate supply module including a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module including a chip transfer-loading platform used for suctioning chips. The chip transfer-loading platform is used at a first position for transferring chips from the chip supply module. The chip transfer-loading platform carries the chips to a second position to bond the chips onto a load plate to form a bonding sheet. A packaging module is used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.